JOJUN-6300 Series Thermal Pad

ʻO ka wehewehe pōkole:

JOJUN-6300 Series Thermal Pad he thermally conductive, hoʻoikaika ʻia nā mea i helu ʻia ma ka thermal conductivity o 3.0 W/MK, hiki ke loaʻa nā pale wela haʻahaʻa i nā haʻahaʻa haʻahaʻa.Hoʻopili maikaʻi kēia pad interface palupalu me ka liʻiliʻi liʻiliʻi, e loaʻa ana i nā hiʻohiʻona maikaʻi loa a me nā hiʻohiʻona pulu, a hiki i nā ʻili me ka ʻeleʻele kiʻekiʻe a me ka topography.

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

★ Nā mea maʻamau o JOJUN-6300 Series Thermal Pad

ʻO nā mea maʻamau o JOJUN6300
Waiwai	Unite	Huahana Huahana	ʻAno hoʻāʻo
Waiwai	Unite	JOJUN6300	ʻAno hoʻāʻo
kalakala		Hoʻopilikino ʻia	Nānā
mānoanoa	mm	0.3-5	ASTM D374
kikoʻī Kaumaha	g/cc	3	ASTM D792
ʻoʻoleʻa	Kahakai oo	20-70	ASTM D2240
Palapala noi Mahana	℃	-50 - +200
Ka hikiwawe Papa		V0	UL94
Māmā ʻO ka hoʻokō	W/mK	3	ASTM D5470
Haʻihaʻi Voltage	KV/mm	>6	ASTM D149
Volume Kū'ē	ohm-cm	10 ^14	ASTM D257
Dielectric Mau	1MHz	7	ASTM D150

★ Noi

Semiconductors i ka wela wela
Nā lako kelepona
Kāleka kiʻi
Nā modula hoʻomanaʻo
ʻO ke kukui kūlana paʻa LED
Kamepiula papapihi, laptops, servers
Mea uila uila
LCD a me PDP pāpaʻi TV

★ Kaʻina Hana Hana

Hoʻohuihui

Extrusion

Laina Hana Papa Thermal

ʻOhi

Pūʻolo

Waiwai Puka

★R&D Center

ʻO ka mea hōʻike hoʻohaʻahaʻa uila

ʻO ka mea hōʻike wela wela

Kneader

Hale Hana

★ Nā hiʻohiʻona a me nā pono

1..ʻO kekahi o nā hiʻohiʻona nui o ka JOJUN-6300 Series Thermal Pad ʻo ia kona ʻano palupalu a paʻa loa.ʻO kēia ka mea maʻalahi i ka lawelawe ʻana a kūpono hoʻi, a puni nā geometries paʻakikī.Hoʻolālā ʻia ka pad e hāʻawi i ke kūpaʻa haʻahaʻa haʻahaʻa ma ke kaomi haʻahaʻa, e hōʻoia i ka hana mau ma lalo o nā kūlana hana like ʻole.

2. ʻO kekahi mea koʻikoʻi o kēia pad, ʻo ia kāna mau mea hoʻopili maikaʻi.Kōkua kēia i ka hoʻopaʻa paʻa ʻana i ka pā, ʻoiai ma nā wahi pilikia nui.Hoʻoikaika pū ka papa adhesive i ka hoʻoili wela maikaʻi, e hōʻoia ana e hoʻopau maikaʻi ʻia ka wela mai nā ʻāpana koʻikoʻi.

3. ʻO ka JOJUN-6300 Series Thermal Pad he mea kūpono ia no ka hoʻohanaʻana i ka nui o nā polokalamu uila, me nā GPU, nā CPU, nā IC, nā kukui LED, a me nā mea'ē aʻe.ʻO kāna mau waiwai kiʻekiʻe e lilo ia i mea hilinaʻi, kumukūʻai, a maikaʻi hoʻi no nā mea hana e nānā ana e hoʻonui i ka hana a me ka hilinaʻi o kā lākou huahana.

★ Palapala

Nā hiʻohiʻona o nā huahana Thermal

Nā hiʻohiʻona o Thermal Pad

1. He maikaʻi ka wela wela: 1-15 W / mK.
2. ʻO ka paʻakikī haʻahaʻa: Aia ka paʻakikī mai Shoer00 10 ~ 80.
3. Hoʻopili uila.
4. Maʻalahi e hui.
Nā hiʻohiʻona o ka Thermal Paste

1. ʻElua ʻāpana hoʻopihapiha hoʻopihapiha hoʻopihapiha, hoʻopili wai.
2. Thermal conductivity: 1.2 ~ 4.0 W/mK
3. ʻO ka hoʻokuʻu uila kiʻekiʻe, ka paʻa kiʻekiʻe, ke kūpaʻa wela maikaʻi.
4. Ke noi hoʻoemi, hiki ke hoʻokō i nā hana automated.
Nā hiʻohiʻona o ka Thermal Grease

1. Hoʻokaʻawale aila haʻahaʻa (i ka 0).
2. Keʻano lōʻihi lōʻihi, hilinaʻi maikaʻi.
3. Ke kū'ē kū'ē i ka wā (kiʻekiʻe a me ka haʻahaʻa haʻahaʻa -40 ~ 150 ℃).
4. Ke kū'ē i ka wai, ke kū'ē ozone, ke kū'ē kahiko.