Hoʻohana ʻia ka pad thermal e hoʻopiha i ka ea ma waena o ka mea hoʻomehana a me ka radiator a i ʻole ke kumu metala.ʻO kā lākou mau mea maʻalahi a elastic e hiki ai ke uhi i nā ʻili like ʻole.Hoʻololi ʻia ka wela mai ka mea hoʻokaʻawale a i ʻole ka papa kaapuni paʻi holoʻokoʻa i ka pahu metala a i ʻole ka pā diffusion, a laila e hoʻonui ai i ka pono a me ke ola lawelawe o nā mea uila wela.
Nā hiʻohiʻona huahana o ka pepa silicone conductive thermal:
ʻO ke kau wela wela maikaʻi: 3W/MK;ʻO ka lipine hoʻopili ponoʻī me ka ʻole o ka hoʻopili ʻana i ka ʻili;ʻO ka compressibility kiʻekiʻe, palupalu a elastic, kūpono no ke kaiapuni noi haʻahaʻa haʻahaʻa;Loaʻa i nā ʻano mānoanoa.
ʻO nā ʻoihana nui ʻeono kahi e hoʻohana nui ʻia ai nā pad wela wela, ʻo ia ka ʻoihana light-emitting diode, ʻoihana uila uila, plasma / light-emitting diode TV ʻoihana, ʻoihana ʻoihana home, ʻoihana lako mana a me ka ʻoihana kamaʻilio.
ʻO ka mea mua, ka hoʻohana ʻana i ka ʻoihana light-emitting diode:
1. Hoʻohana ʻia ka pepa silicone conductive thermal ma waena o ka substrate alumini a me ka radiator.
2. Hoʻohana ʻia ka pepa silicone conductive thermal ma waena o ka substrate alumini a me ka pūpū.
ʻElua, noi ʻoihana uila uila:
1. Hiki ke hoʻohana ʻia ka pepa silicone conductive thermal i nā ʻoihana ʻenehana uila (e like me xenon lamp ballast, sound system, nā huahana kaʻa, etc.).
ʻEkolu, hōʻike plasma/LED TV noi:
1. Heat conduction ma waena o ka mana amplifier integrated circuit, image integrated circuit and radiator (shell).
ʻEhā.ʻOihana Mea Hana Hale:
1. Hiki ke hoʻohana ʻia ka umu microwave/ea (ma waena o ka mana kaʻa uila i hoʻohui ʻia a me ka pūpū)/ umu induction (ma waena o ka thermistor a me ka radiator) no ka hoʻomehana ʻana i ka pepa silicone conduction.
ʻelima.ʻoihana lako mana:
1. Pepa silicone hoʻoheheʻe i loko o ka paipu semiconductor oxide, transformer (a i ʻole capacitor/power factor hoʻoponopono inductor) a me ka wela hoʻoheheʻe ʻana a i ʻole ka wela conduction shell.
ʻeono.ʻoihana kamaʻilio:
1. Heat conduction a me ka wela dissipation ma waena o ka motherboard integrated circuit a me ka radiator a pūpū paha.
2. Heat conduction and dissipation heat between DC-DC integrated circuit and set-top box shell.
Ka manawa hoʻouna: Jan-09-2023