He aha nā hoʻololi o ka mana wela kūikawā o ʻelua ʻāpana thermal paste pad ma hope o ka ʻelemakule?

ʻO ka mana wela kikoʻī o kēia nui mea, no ka pepa silica gel wela, nā mea hoʻololi ʻana i ke ʻano wela, ʻoi aku ka liʻiliʻi o ka pahu wai wela wai pālua, ʻaʻole pinepine.ʻAʻole like me ka thermal conductivity, thermal resistance, hardness, breakdown voltage a pēlā aku i ʻoi aku ka pinepine o kēia mau ʻāpana, pono e hoʻāʻo ʻia kēlā me kēia pūʻulu.I kēia lā, makemake wale mākou e kamaʻilio e pili ana i ka ʻikepili hoʻāʻo ʻana i ka wela wela o ka lua-agent thermal gel gasket, i hoʻāʻo ʻia ma CTI, a he ʻoiaʻiʻo a hilinaʻi ka ʻikepili, no laila e kaʻana like me ʻoe i nā loli i ka kikoʻī. ʻO ka mana wela o ka ʻāpana wela ʻelua ma hope o ka ʻelemakule. ʻO ka helu hōʻike hōʻike ʻo A218021754030106E

1, mea ho'āʻo: wikiwiki hoʻololi wela keʻena ho'āʻo, kiʻekiʻe a me haʻahaʻa wela alternating humidity a me ka wela keena ho'āʻo, mau wela a me ka haʻahaʻa ho'āʻo keʻena, differential scanning surface calorimetric kūkākūkā.
2, kūlana kaiapuni: wela 22.5 ℃, haʻahaʻa 48%RH.
3. Hōʻike maʻamau: GB / T 19466.4-2016
4, kūlana ho'āʻo: kūlana kahiko

Kūlana 1: Ho'āʻo wela humid mau: ka mahana 85,85% RH manawa ho'āʻo 600 / 900 / 1500h;
Kūlana 2: Ho'āʻo hoʻololi wela wikiwiki: haʻahaʻa haʻahaʻa:-40 ℃, haʻahaʻa haʻahaʻa manawa paʻa: 1h, wela kiʻekiʻe 130 ℃, kiʻekiʻe kiʻekiʻe e paʻa ana ka manawa: 1h, wela hoʻololi: 5′ ℃ / min, hoʻāʻo cycle 192/288/ 383 pōʻaiapuni;
Kūlana 3: Ka hopena wela kiʻekiʻe a me ka haʻahaʻa: Ma hope o ka ʻelemakule wela kiʻekiʻe no 1200h, ʻelemakule haʻahaʻa haʻahaʻa no 1200h, kiʻekiʻe wela 130 ℃, manawa hoʻāʻo: 600/900/1200h;Haʻahaʻa wela -40 ℃, manawa hoʻāʻo: 600/900/1200h;