2023 Hoʻolālā Hou Conductive Pad Thermal Interface Material Thermal Pad GPU GPU CPU Heatsink Cooling Hot Sales Factory Hana ʻia 0.5mm a 10mm 1~12W/M.K

Manaʻo mākou i ka manaʻo o ka poʻe kūʻai aku, ka wikiwiki o ka wikiwiki e hana i ka wā o ka makemake o kahi mea kūʻai aku o ke kumu kumu, e ʻae ana i ka ʻoi aku ka maikaʻi o ka maikaʻi, e hōʻemi i nā kumukūʻai hoʻoili, ʻoi aku ke kūpono o nā kumukūʻai, lanakila i nā mea kūʻai hou a me nā mea kūʻai mua i ke kākoʻo a me ka hōʻoia no 2023 Hoʻolālā Hou Conductive Pad Thermal Interface Material Thermal Pad GPU GPU CPU Heatsink Cooling Hot Sales Factory Hana ʻia 0.5mm a 10mm 1~12W/M.K, mākou, me nā lima hāmama, kono aku i nā mea kūʻai hoihoi a pau e kipa i kā mākou pūnaewele a i ʻole e kelepona pololei iā mākou no ka ʻike hou aku.
Manaʻo mākou i ka manaʻo o ka poʻe kūʻai, ka wikiwiki o ka wikiwiki e hana i ka wā o ka makemake o kahi mea kūʻai aku o ke kumu kumu, e ʻae ana i ka ʻoi aku ka maikaʻi o ka maikaʻi, e hoʻemi i nā kumukūʻai hana, ʻoi aku ke kūpono o nā kumukūʻai, lanakila i nā mea kūʻai hou a me nā mea kūʻai mua i ke kākoʻo a me ka hōʻoia no kaKina Thermal Grease a me Thermal Silicone Grease, Ma ke ʻano he hale hana akamai mākou e ʻae pū i ke kauoha maʻamau a hana like me kāu kiʻi a i ʻole ka laʻana e hōʻike ana i ka kikoʻī a me ka hoʻolālā ʻana o ka mea kūʻai aku.ʻO ka pahuhopu nui o ka hui ʻo ia ke ola i kahi hoʻomanaʻo maikaʻi i nā mea kūʻai aku a pau, a hoʻokumu i kahi pilina ʻoihana lanakila-lanakila lōʻihi.No ka ʻike hou aku, pono ʻoe e kelepona mai iā mākou.A ʻo ko mākou hauʻoli nui inā makemake ʻoe e hālāwai pilikino ma kā mākou keʻena.

★ Nā ʻano maʻamau o ka ʻaila Thermal

★ Noi

ʻĀpana LED
lako kamaʻilio,
PPU kelepona paʻalima,
Module hoʻomanaʻo,
IGBT
Nā modula mana,
Kahua semiconductor mana.

★ Nā Mea Hana Hana

★ Kaʻina Hana Hana

Hoʻohuihui

Extrusion

Laina Hana Papa Thermal

ʻOhi

Pūʻolo

Waiwai Puka

★R&D Center

ʻO ka mea hōʻike hoʻohaʻahaʻa uila

ʻO ka mea hōʻike wela wela

Kneader

Hale Hana

★ Nā hiʻohiʻona a me nā pono

Me ka hoʻoili wela maikaʻi, i ka manawa like me ka paʻa maloʻo, ʻaʻole paʻa, ʻaʻole hoʻoheheʻe, ʻono ʻole a me nā mea ʻawaʻawa;
ʻO ka conductivity thermal maikaʻi loa, me ka hoʻokaʻawale ʻana o ka aila haʻahaʻa, ka aila wela kiʻekiʻe, ʻaʻole kahe ka wela kiʻekiʻe;
ʻO ka hana insulation maikaʻi loa, ʻaʻohe mea ʻawaʻawa a ʻono ʻole, ʻaʻohe hoʻōla, ʻaʻohe corrosion i ka substrate, paʻa nā waiwai a me ke kino;
ʻO ke kūlana kiʻekiʻe a me ka haʻahaʻa haʻahaʻa, ka pale wai, ka ozone, ka pale ʻana i ka wā kahiko, hiki ke hoʻohana ʻia i ke kiʻekiʻe a me ka haʻahaʻa wela no ka manawa lōʻihi;
ʻO ka thixotropy maikaʻi, ke kūlike kūpono, maʻalahi ke hoʻohana, ka uhi ʻana a i ʻole ke kaʻina hana sila;
Me ka maikaʻi uila insulation, a me ka maikaʻi thermal conductivity, i ka ia manawa me ka haʻahaʻa aila kaawale (manaʻo i ka zero), kiʻekiʻe a me ka haʻahaʻa wela kū'ē, ka wai kū'ē, ozone, aniau elemakule kū'ē.

★ Palapala

Manaʻo mākou i ka manaʻo o ka poʻe kūʻai, ka wikiwiki o ka wikiwiki e hana i ka wā o ka makemake o kahi mea kūʻai aku o ke kumu kumu, e ʻae ana i ka ʻoi aku ka maikaʻi o ka maikaʻi, e hoʻemi i nā kumukūʻai hana, ʻoi aku ke kūpono o nā kumukūʻai, lanakila i nā mea kūʻai hou a me nā mea kūʻai mua i ke kākoʻo a me ka hōʻoia no 2019 Hoʻolālā Hou Conductive Pad Thermal Interface Material Thermal Pad GPU GPU CPU Heatsink Cooling Hot Sales Factory Hana ʻia 0.5mm a 10mm 1~12W/M.K, E kono mākou i nā mea kūʻai hoihoi a pau e kipa i kā mākou pūnaewele a i ʻole e kelepona pololei iā mākou no ka ʻike hou aku.
2019 Hoʻolālā Hou China Thermal Pads a me Thermal Silicone Pad, Ma ke ʻano he hale hana ʻike mākou e ʻae pū i ke kauoha maʻamau a hana like me kāu kiʻi a i ʻole ka laʻana e hōʻike ana i ka kikoʻī a me ka hoʻolālā ʻana o ka mea kūʻai aku.ʻO ka pahuhopu nui o ka hui ʻo ia ke ola i kahi hoʻomanaʻo maikaʻi i nā mea kūʻai aku a pau, a hoʻokumu i kahi pilina ʻoihana lanakila-lanakila lōʻihi.No ka ʻike hou aku, pono ʻoe e kelepona mai iā mākou.